Hard Copy Detail
Item Ref:HC0222 |
Location:Hursley Archive - HLG10 - Cupboard / Rack: HC12 - Shelf: 3 |
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Document Title or |
Description |
Author |
Date Published |
Donor |
Binder Containing: | Manufacturing Engineering Documentation | Various | ||
Where several items are filed together in one binder or folder, the individual titles are shown below |
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EN.20.0158 | Technical Report - Pyrophosphate Copper Plating of SLT Panels | IBM | 1967 | |
EN.20.0150 | Nodules in SLT Plated-Through Holes | IBM | 1966 | |
EN.20.0152 | A Method of Detecting Drill Smear on SLT Interplanes | IBM | 1967 | |
EN.20.0151 | Characterization of Surface Nodules on Copper-Plated SLT Panels | IBM | 1967 | |
Elimination of Fractures | in Plated-Through-Hole Printed Circuit Boards - article | EW Broache, J A Poch | 1966 | |
Properties & Behaviour | of Precious-Metal Electrodeposits for Electrical Contacts - article | H C Angus | 1962 | |
TR 01.16.022.613 | Palladium as a Low Energy Circuit Contact Material - Part 1 Electrodeposition | G D Fatzer | 1960 | |
Constriction Resistance | and the Real Area of Contact - article | J A Greenwood | 1966 | |
Surface Films | on Precious Metal contacts - article | H C Angus | 1962 | |
Long Life Low Voltage Contacts | IEE Article - 2 copies | A Fairweather, F Lazenby, AE Parker | 1962 | |
Current Ideas | in the Philosophy of Testing Electrical Contacts | H B Ulsh IBM | 1966 | |
The Effect od Air Pollution | on Electrical Contacts - article | M Antler, J Gilbert | 1963 | |
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